Qualcomm Snapdragon 865 core configuration and clock speeds leaked online

Days after Qualcomm confirmed it will be hosting the Snapdragon Tech Summit on December 3 where the Snapdragon 865 is likely to launch, the upcoming flagship chipset surfaced online, thanks to a new leak. With the official launch still about three weeks away, we now have more information to break about the flagship chipset that will be powering high-end smartphones next year.

Chinese leakster @DigitalChatStation has leaked the core configuration of the Snapdragon 865 on Weibo. According to the leak, the SD865 will be an octa-core chipset just like the previous Snapdragon 855. Same as before, the Snapdragon 865 will sport a 1+3+4 core setup which includes one prime core for high performance, three mid cores for the slightly less intensive tasks and four efficiency cores for the rest of the tasks.

Credit: Gizmochina

The leak further revealed the prime core will be based on ARM Cortex-A77 with peak frequency of 2.84GHz, while the 3 mid-cores will run at 2.42 GHz, also modeled on a custom design based on the Cortex-A77. Lastly, the four efficiency cores will be clocked at 1.8GHz and will be based on Cortex-A55 cores. The leak also revealed the GPU on the SD865 will be the Adreno 650 clocked at 587MHz.

Interestingly, the leak core configuration and the clock speeds are the same as the Snapdragon 855. Despite that, there is scope for a boost in performance thanks to the custom core designs based on the latest ARM cores. The leakster claims Qualcomm is looking at a 20 percent boost in CPU performance and 17 to 20 percent boost in GPU rendering. There is no information on the power efficiency gains, but we expect it to be around the same as the Snapdragon 855, based on what ARM revealed about the new CPU cores not being very different from its predecessor, from a microarchitecture point of view. Previously, the Snapdragon 865 had appeared on Geekbench revealing a 17 percent boost in benchmark numbers.

The Snapdragon 865 could debut with the Samsung Galaxy S11 series in the US early next year, ideally a few days before the Mobile World Congress in Barcelona. It will be manufactured on TSMC’s 7nm process and one variant of the chip could come with an integrated 5G modem, which is likely the Snapdragon X55 5G modem.

We will be at the Snapdragon Summit in Hawaii for more in-depth coverage from December 3 where Qualcomm is also expected to announce chips for laptops, mid-range phones, wearables and smart speakers.

from Latest Technology News https://ift.tt/2OaOYXF